Product Overview
These tapes are available with a protection of paper liner. This range of products can be easily activated by pressure and heat. These tapes are well known for various qualitative features like high bonding strength, dimensional accuracy, heat and chemical resistance. Application areas: Chip Modules in smart cards Bonding of glass fibers, foils, and plastic parts Particularly suitable for work pieces of smooth surfaces requiring bonding Attributes: High performance Long service life Heat resistance
These tapes are available with a protection of paper liner. This range of products can be easily activated by pressure and heat. These tapes are well known for various qualitative features like high bonding strength, dimensional accuracy, heat and chemical resistance. Application areas: Chip Modules in smart cards Bonding of glass fibers, foils, and plastic parts Particularly suitable for work pieces of smooth surfaces requiring bonding Attributes: High performance Long service life Heat resistance
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