Product Overview
Our range of Thermally Conductive Double Tape is filled by high-performance acrylic pressure sensitive adhesive with high thermal conductivity ceramic particle coating made of glass fiber cloth on both sides or without the substrate. Between the electronic device and heat sink to provide efficient heat conduction. Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.
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Building A,The West Area in Xueziwei Industrial Zone of Houting Village,Shajing Town,Baoan District,Shenzhen,China
Our range of Thermally Conductive Double Tape is filled by high-performance acrylic pressure sensitive adhesive with high thermal conductivity ceramic particle coating made of glass fiber cloth on both sides or without the substrate. Between the electronic device and heat sink to provide efficient heat conduction. Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.
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