Epoxy Coating System 250-S

Product Description

Epoxy System 250-S is specially formulated with proper selection of fillers and pigments for low viscosity and better chemical resistance. It is ready to use filled system having low viscosity at processing temperatures. Epoxy System 250 S can be used with Hardener Epoxy-PAM for room temperature curing adhesive or bonding application. Characteristics of Fully Cured System: Good adhesion to most organic and inorganic materials ( with proper etching) Good mechanical and electrical properties combined with Good chemical and water resistance Increased thermal conductivity