Product Overview
Following are the main specifications of BGA Chip Repair Machine For Motherboards DH-A2: 1.Total power: 5200W 2.Three independent heating zone: top hot air heater 1200W, bottom hot air heater1200W, IR preheater 2700W 3.Voltage: AC220VA 10% 50/60HZ 4.Positioning: V-groove, PCB support can be adjusted in X, Y direction and equipped with external universal fixture 5.Temperature accuracy: A 2a 6.PCB size: Max 440x380mm, Min22x22mm 7.BGA chip: 2x2~80x80mm 8.Minimum chip spacing: 0.15mm 9.Camera magnification: 10x-100x 10.Temperature control: K sensor, closed loop 11.shadowless LED light 12.Powerful cross flow fan 13.External temperature sensor: 1(optional) 14.Built-in vacuum slot, USB port 15.Dimensions: 60x70x85cm 16.N.W.:78kg 17. G.W.: 100kg 18.Packed: in wooden box 19.Main feature: semi-automatic CCD camera optical alignment, laser positioning, PLC control
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4th Floor, Building 6B, Shengzuozhi Industrial Park, Xinyu Rd., Shajing Town,
Following are the main specifications of BGA Chip Repair Machine For Motherboards DH-A2: 1.Total power: 5200W 2.Three independent heating zone: top hot air heater 1200W, bottom hot air heater1200W, IR preheater 2700W 3.Voltage: AC220VA 10% 50/60HZ 4.Positioning: V-groove, PCB support can be adjusted in X, Y direction and equipped with external universal fixture 5.Temperature accuracy: A 2a 6.PCB size: Max 440x380mm, Min22x22mm 7.BGA chip: 2x2~80x80mm 8.Minimum chip spacing: 0.15mm 9.Camera magnification: 10x-100x 10.Temperature control: K sensor, closed loop 11.shadowless LED light 12.Powerful cross flow fan 13.External temperature sensor: 1(optional) 14.Built-in vacuum slot, USB port 15.Dimensions: 60x70x85cm 16.N.W.:78kg 17. G.W.: 100kg 18.Packed: in wooden box 19.Main feature: semi-automatic CCD camera optical alignment, laser positioning, PLC control
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